Technical Specifications
S450-W
Key Features
FEATURES：
1. High precision close loop force control
2. DSP phase lock,stable ultrasonic output
3. Excellent fine wire control and super adaptability for soft substrates
4. Self-study English GUl for advanced process
5. Drive by electricity without compressed air
Technical Specifications
Bond Wire
Au(15~75μm),Al(18~100μm),Alloy wire（18~25μm）
Bond Head Z Range
18mm
Device Depth
Max:21mm
Bond Head X-Y Range
X=15mm,Y=15mm
Type of Bonding Tools
19mm,25mm
Spool
Standard :1/2 inch；Optional : 2 inch
Lifting Table Z Range
0~18mm
Lifting Table X-Y Range
250mm×270mm
Input Voltage
220V±10%@50~60Hz
Bond Force
1~250g
Input Voltage
220V±10%@50~60Hz
Power Consumption
≤500W
Weight
GW.≈47kg,NW.≈70kg
Clamping Table
Maximum Temperature 200℃
Footprint
≤620mm x 640mm x 450mm(W x D x H)
Performance
High Precision
Build Standard
Industrial Grade