Technical Specifications
S450P-B
Key Features
FEATURES：
1. High precision close loop force control(accuracy within 1g)
2. Support high/low frequency transducer
3. One key switch high/low power
4. Drive by electricity without compressed air
5. Unique tailless bumping process
6. Bond head designed by parallelogram support large module of deep access
Technical Specifications
Bond Wire
Au(15~75μm),Pt(18~25μm), Cu(18~50μm),Ag(18~50μm)
Bond Head Z Range
18mm
Device Depth
Max:15mm
Bond Head X-Y Range
X=15mm,Y=15mm
Type of Bonding Tools
19mm、16mm
Lifting Table X-Y Range
250mm×270mm
Lifting Table Z Range
0~18mm
Bond Force
1~250g
Power Consumption
≤500W
Bond Power
Numerical control,1000x subdivision
Weight
GW.≈47kg,NW.≈70kg
Clamping Table
Maximum Temperature 200℃
Footprint
≤620mm x 640mm x 450mm(W x D x H)
Performance
High Precision
Build Standard
Industrial Grade