Technical Specifications
High-Precision Die Attacher DA0300S
Key Features
Product Features：
- Supports Flexible Multi-Reference Die Attach
- Multi-Die Mounting, User-Friendly Programming
- Integrated Inline Contact Height Measurement
- High-Precision Force Control with Accuracy ±1 g
- Inline Production, Worktable Mode Optional
- Top & Bottom Vision High-Precision Positioning Function
- Transfer Stage Auxiliary High-Precision Positioning (Optional)
- Fast & High-Precision Horizontal Rotary Head
- Flexible Process Flow, Free Combination of Working Procedures, Single Procedure Disable Available
- Multiple PR Recognition Modes (Template Matching, Edge Positioning, Reference Pattern Positioning, Geometric Center Positioning, etc.)
Technical Specifications
Position Accuracy
±3 μm @ 3sigma
Travel Range
X=386 mm, Y=716 mm, Z=50 mm
Angle Accuracy
±0.15° @ 3sigma
Max Cavity Depth
15 mm
Height Measurement Accuracy
±1 μm
Height Measurement Method
Contact Type
Die Size
Min 0.2 mm × 0.2 mm, Max 15 mm × 15 mm
Bonding Force
15 ~ 500 g
Wafer Gel Pack Size
2-inch, compatible with 4-inch
Force Control Accuracy
±2 g
Quantity of Wafer Gel Packs
22 pcs of 2-inch + 2 pcs of 4-inch OR 30 pcs of 2-inch
UPH
1200
UPH
1200
Nozzle Quantity
12
Operating System
Windows 10
Performance
High Precision
Build Standard
Industrial Grade