Technical Specifications
High-Precision Dispensing & Die Attach Integrated Machine AP0300WE
Key Features
Product Features：
- Fast & High-Precision Horizontal Rotary Head
- Wafer Mapping Function
- Dual-Field Vision System with Low & High Magnification
- Supports Flexible Multi-Reference Die Attach
- Real-Time Vision Center Calibration
- 3D Stacking Function with Max Stack Height up to 5 mm
- Integrated Inline Contact Height Measurement, Supports Dispensing Needle Height Detection
- Flexible Process Flow, Free Combination of Working Procedures, Single Procedure Disable Available
- Multiple PR Recognition Modes (Template Matching, Edge Positioning, Reference Pattern Positioning, Geometric Center Positioning, etc.)
- Various Standard Pre-set Dispensing Patterns, Custom Patterns & Pattern Overlay Supported
- Class 100 Cleanroom Standard (Optional)
Technical Specifications
Force Control Accuracy
±2 g
Nozzle Quantity
12 (with height measurement function)
Position Accuracy
±3 μm @ 3sigma
Height Measurement Method
Contact Type
Angle Accuracy
±0.15° @ 3sigma
Dispensing Valve
Musashi Precision Pneumatic Control Valve SUPER ΣCMIII
Travel Range
X=360 mm, Y=657 mm, Z=30 mm
Adhesive Type
Epoxy
Syringe Size
3 cc, 5 cc, 10 cc
Die Size
Min 0.2 mm × 0.2 mm, Max 15 mm × 15 mm
Wafer Size
8-inch, compatible with 4-inch & 6-inch
Min Dot Diameter
∅0.25 mm
Wafer Gel Pack Size
2-inch
Bonding Force
15 ~ 500 g
UPH (Units Per Hour)
1200 (Die Attach Only)
Quantity of Wafer Gel Packs
20 pcs, expandable to 30 pcs
Operating System
Windows
Performance
High Precision
Build Standard
Industrial Grade